LPDDR4X | Chipsmall

LPDDR4XResults: 29

Liphetho tse setseng: 29

Sehlahisoa	Inventory ea	Theko ea thepa ka 'ngoe
K4UBE3D4AM-GUCL SAMSUNG 32 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 125 °C 200FBGA Mass Production	5495 (e fumaneha)	1+11.99980 10+10.79982 30+8.39986 Theko e eketsehileng
K3UH5H50AM-AGCL SAMSUNG 32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production	3644 (e fumaneha)	Ho botsa
K4UHE3D4AA-GUCL SAMSUNG 24 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 125 °C 200FBGA Mass Production	5402 (e fumaneha)	Ho botsa
K4UHE3D4AA-GHCL SAMSUNG 24 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 105 °C 200FBGA Mass Production	4972 (e fumaneha)	Ho botsa
K3UH5H50AM-JGCL SAMSUNG 32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 432FBGA Mass Production	5177 (e fumaneha)	Ho botsa
K4U2E3S4AA-GHCL SAMSUNG 12 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 105 °C 200FBGA Mass Production	3485 (e fumaneha)	Ho botsa
K3UH7H70AM-JGCL SAMSUNG 64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 432FBGA Mass Production	5259 (e fumaneha)	Ho botsa
K4UCE3Q4AA-MGCL SAMSUNG 64 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 200FBGA Mass Production	9115 (e fumaneha)	1+36.86942 10+27.65207 30+23.96512 Theko e eketsehileng
K4UBE3D4AM-GHCL SAMSUNG 32 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 105 °C 200FBGA Mass Production	3506 (e fumaneha)	Ho botsa
K4UHE3D4AA-GFCL SAMSUNG 24 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 95 °C 200FBGA Mass Production	5487 (e fumaneha)	Ho botsa