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Liphetho tse setseng: 38

Sehlahisoa	Inventory ea	Theko ea thepa ka 'ngoe
KLM8G1GESD-B03P SAMSUNG eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production	4877 (e fumaneha)	1+9.96188 10+8.96569 30+6.97332 Theko e eketsehileng
KLMBG4GEUF-B04P SAMSUNG eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production	3334 (e fumaneha)	1+41.43260 10+31.07445 30+26.93119 Theko e eketsehileng
KLMAG2GESD-B03Q SAMSUNG eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production	3490 (e fumaneha)	Ho botsa
KLMAG1JETD-B041 SAMSUNG eMMC 5.1 16 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production	80320 (e fumaneha)	1+23.37920 10+17.53440 30+15.19648 Theko e eketsehileng
KLMDG8JEUD-B04P SAMSUNG eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C Mass production	3766 (e fumaneha)	1+28.06836 10+21.05127 30+18.24443 Theko e eketsehileng
KLMDG4UCTB-B041 SAMSUNG eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Sample	24554 (e fumaneha)	1+126.00000 10+98.00000 30+84.00000 Theko e eketsehileng
KLMAG2GEUF-B04P SAMSUNG eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production	4026 (e fumaneha)	1+17.99200 10+16.19280 30+12.59440 Theko e eketsehileng
KLMAG2GESD-B04P SAMSUNG eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production	4017 (e fumaneha)	Ho botsa
KLMCG4JEUD-B04Q SAMSUNG eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C Mass production	4159 (e fumaneha)	1+73.15568 10+54.86676 30+47.55119 Theko e eketsehileng
KLMCG8GESD-B03Q SAMSUNG eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production	24629 (e fumaneha)	1+28.70000 10+21.52500 30+18.65500 Theko e eketsehileng